Publications


  • Y. Chon, H. Shin, E. Talipov, H. Cha, “Evaluating Mobility Models for Temporal Prediction with High-Granularity Mobility Data,” in Proceeding of 10th IEEE International Conference on Pervasive Computing and Communications (PerCom’12), 2012, IEEE, Lugano, Switzerland, Accept Ratio 19% (28 accepted out of 150 submissions).
  • E. Talipov, Y. Chon, H. Cha, “Content Sharing Over Smartphone-based Delay Tolerant Networks,” IEEE Transactions on Mobile Computing (TMC), to be appeared, 2012. [at IEEEXplore]
  • Y. Chon, E. Talipov, H. Shin, H. Cha, “Mobility Prediction based Smartphone Energy Optimization for Everyday Location Monitoring,” in Proceeding of 9th ACM Conference on Embedded Networked Sensor Systems (SenSys), 2011, ACM, Seattle, WA, USA. pp. 82-95, Acceptance Ratio 19% (24 accepted out of 123 submissions). [at ACM Library]
  • H. Shin, Y. Chon, H. Cha, “Unsupervised Construction of Indoor Floor Plan using Smartphone,” IEEE Transactions on Systems, Man, and Cybernetics, Part C: Application and Reviews (SMCC), to be appeared, 2011. [at IEEEXplore]
  • H. Shin, Y. Chon, K. Park, H. Cha, “FindingMiMo: Tracing a Missing Mobile Phone using Daily Observations,” in Proceeding of 9th ACM International Conference on Mobile Systems, Applications, and Services (MobiSys), 2011, ACM, Washington, DC, USA. pp. 29-42, Acceptance Ratio 18% (25 accepted out of 141 submissions). [at ACM Library]
  • Y. Chon, E. Talipov, H. Cha, “Autonomous Management of Everyday Places for Personalized Location Provider,” IEEE Transactions on Systems, Man, and Cybernetics, Part C: Application and Reviews (SMCC), to be appeared, 2011. [at IEEEXplore]
  • Y. Chon, H. Cha, “LifeMap: A Smartphone-based Context Provider for Location-based Services,” IEEE Pervasive Computing, vol. 10, no. 2, pp. 58-67, April-June. 2011. [at IEEEXplore]
  • Y. Kim, Y. Chon, H. Cha, “Smartphone-based Collaborative Autonomous Radio Fingerprinting,” IEEE Transactions on Systems, Man, and Cybernetics, Part C: Application and Reviews (SMCC), vol.42, no.1, pp.112-122, IEEE, 2012. [at IEEEXplore]
 

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